TL;DR
R&D Physical Design Engineer (Embedded IoT Dev): Developing physical design implementation including floor planning, placement, design closure, STA, and DRC & LVS with an accent on ASIC design flow and VLSI expertise. Focus on handling block implementation and top-level tasks independently, tapeout experience in 7nm and below process nodes, and running full chip signoff tasks.
Location: China, Shanghai, Zhangjiang Hi Tech
Company
Broadcom is a global technology leader designing and supplying semiconductor and infrastructure software solutions.
What you will do
- Perform physical design implementation tasks including floor planning, placement, design closure, STA, DRC, and LVS.
- Handle block implementation and top-level tasks independently.
- Run full chip signoff tasks such as PI, SI, PV, and STA.
- Collaborate on ASIC design flow and VLSI development.
- Utilize scripting skills in Perl and Tcl for automation and problem solving.
Requirements
- Location: Must be based in Shanghai, China
- 7+ years experience with MS degree preferred in Microelectronics or related discipline.
- Strong understanding of ASIC design flow and solid VLSI background.
- Tapeout experience in 7nm and below process design.
- Strong communication and problem solving skills.
- Proficiency in Perl and Tcl scripting.
Nice to have
- Experience with DFT insertion.
- Power and IVD analysis skills.
- Experience with DRC/LVS and STA.
Culture & Benefits
- Equal opportunity employer with inclusive hiring practices.
- Global technology leader with innovative environment.
- Focus on technical challenges and professional growth.