TL;DR
Summer Internship Testing Active Probe Development: Design, develop, and validate active probe solutions for high-speed signal measurement and debugging in Automated Test Equipment. With an accent on analog and mixed-signal circuit design, high-speed PCB layout, and performance validation. Focus on building prototypes, circuit simulations, and detailed documentation in a lab environment.
Location: Gratkorn, Austria (onsite)
Salary: 2100 EUR gross monthly
Company
NXP Semiconductors is a global leader in secure connectivity solutions for embedded applications, driving innovation in automotive, industrial IoT, mobile, and communication infrastructure markets.
What you will do
- Design active analog/mixed-signal probe front-ends including amplifiers, buffers, and protection circuits
- Develop high-speed PCB layouts optimized for signal integrity and electromagnetic compatibility
- Select and evaluate components, perform circuit simulations and system-level modeling
- Build and characterize prototypes using lab measurement equipment
- Conduct performance validation including bandwidth, noise, and linearity tests
- Create detailed schematics, layout documentation, and validation reports
Requirements
- Location: Must be able to work onsite in Gratkorn, Austria
- Currently pursuing studies in Electrical Engineering, ICE/Telematics, Biomedical Engineering or similar
- Solid knowledge in analog and mixed-signal circuit design
- Experience with PCB layout and simulation tools (Spice)
- Hands-on experience with lab measurement equipment and debug techniques
- Good English skills (spoken and written)
Culture & Benefits
- Full-time internship for 2–3 months between June and September 2026
- Opportunity to see ideas come to life in real lab environments
- Potential to convert internship topic into bachelor or master thesis
- Commitment to diversity, inclusion, and sustainability
- Learning opportunities to develop core and professional skills