TL;DR
Product Engineer II (Semiconductor): Developing, validating, and deploying 3D-IC system-level design and physical implementation flows with an accent on flow automation and verification of simulation results. Focus on working closely with cross-functional teams and customers to drive 3D-IC implementation, RC extraction, analysis, and verification flow enablement.
Location: Onsite in Hsinchu, Taiwan
Company
Cadence hires and develops leaders and innovators who want to make an impact on the world of technology.
What you will do
- Develop, validate, and deploy 3D-IC system-level design planning and physical implementation flow.
- Design flow automation for 3D-IC system-level analysis and physical verification, and verify simulation results.
- Work closely with cross-functional teams, project managers, and customers to drive 3D-IC implementation, RC extraction, analysis, and verification flow enablement.
Requirements
- Solid working knowledge and hands-on experience in synthesis, block, or top-level physical PnR implementation, and signoff flows.
- Strong programming and scripting skills in Tcl and Shell.
- BS or MS degree in EE, EECS, or CE with 3 years of engineering experience in the semiconductor industry.
- Excellent written and verbal communication skills, problem-solving, and organization skills.